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Low Capacitance TVS for Ethernet and Telecom Interfaces
PROTECTION PRODUCTS - TransClamp Description
A TransClamp is a low capacitance TVS array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and Lightning. These devices integrate low capacitance, surge-rated compensation diodes with a high power transient voltage suppressor (TVS). The compensation diodes are arranged in a bridge pattern allowing the device to be connected in common mode and/or differential mode. This allows the designer maximum flexibility and reduces parts count. The capacitance of the device is limited to 12pF maximum from line-to-line to ensure correct signal transmission on high-speed lines. These devices may be used to meet Telcordia GR-1089CORE short-haul (intra-building) surge requirements and will withstand a minimum 100 A surge for a 2/10s pulse. The TClampTM3302N is in a 10-pin, RoHS/WEEE compliant, SLP2626P10 package. It measures 2.6 x 2.6 x 0.60mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are particularly well suited for applications where board space is at a premium such as integrated connectors/ magnetics and carrier class Ethernet equipment.
TCLAMP3302N
Features
Transient protection for high-speed data lines to Bellcore 1089 (Intra-Building) 100A (2/10s) IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) L5, 95A (8/20s) Low capacitance (12pF line-to-line) Low operating voltages (3.3V) Low clamping voltage Small SLP Package saves board space Solid-state technology
Mechanical Characteristics
SLP2626P10 10L package RoHS/WEEE Compliant Nominal Dimensions: 2.6 x 2.6 x 0.60 mm Lead Pitch: 0.5mm Molding compound flammability rating: UL 94V-0 Marking: Marking Code Packaging: Tape and Reel
Applications
10/100/1000 Ethernet T3/E3 Integrated Magnetics Carrier Class Equipment Customer Premise Equipment
Circuit Diagram
LINE 1 (1, 2, 3)
Package Configuration
2.60
12 C L
C 2.60 L
Center Tab
0.50 BSC
LINE 2 (8, 9, 10)
0.60
10 Pin SLP package (Bottom Side View) Nominal Dimensions in mm
Revision 01/17/2008 1 www.semtech.com
TCLAMP3302N
PROTECTION PRODUCTS Absolute Maximum Rating
Rating Peak Pulse Power (tp = 2/10s) Peak Pulse Current (tp = 2/10s) Peak Pulse Current (tp = 8/20s) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Operating Temperature Storage Temperature Symbol Ppk IPP IPP VESD TJ TSTG Value 2500 120 95 30 30 -40 to +85 -55 to +150 Units Watts A A kV C C
Electrical Characteristics (T=25oC unless otherwise specified)
TCLAMP3302N Parameter Reverse Stand-Of f Voltage Punch-Through Voltage Snap-Back Voltage Reverse Leakage Current Clamping Voltage Clamping Voltage Junction Capacitance Symbol VRWM VPT VSB IR VC VC Cj Conditions T=25C to 85C IPT = 2A T=25C ISB = 50mA VRWM = 3.3V, T=25C IPP = 100A, tp = 2/10s Line-to-Ground IPP = 100A, tp = 2/10s Line-to-Line Between I/O pins and Gn d VR = 0V, f = 1MHz Between I/O pins VR = 0V, f = 1MHz 3.5 2.8 1 22 25 25 Minimum Typical Maximum 3.3 Units V V V A V V pF
12
pF
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TCLAMP3302N
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
100
Power Derating Curve
110 100 90 80 70 60 50 40 30 20 10 0
Peak Pulse Power - P (kW) PP
10
1
0.1 0.1 1 10 Pulse Duration - tp (s) 100 1000
% of Rated Power or IPP
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Normalized Junction Capacitance vs. Reverse Voltage (Line-to-Line)
1.5 1.4 1.3 CJ (VR) / CJ (VR=0) 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 3.5
CJ (VR) / CJ (VR=0) 1.5
Normalized Junction Capacitance vs. Reverse Voltage (Line-to-Ground)
1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 3.5
f = 1 MHz
f = 1 MHz
Clamping Voltage vs. Peak Pulse Current
Normalized Junction Capacitance vs. Temperature
1.4 1.2
24 22 20
Line - to - Line
Clamping Voltage - V C (V)
18 16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 110
1 Cj (T) /Cj (25oC) 0.8 0.6 0.4 Waveform Parameters: tr = 2s td = 10s 0.2 0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 Temperature - Ta ( C )
Line - to - Ground
Peak Pulse Current - IPP (A)
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TCLAMP3302N
PROTECTION PRODUCTS Typical Characteristics
Typical Insertion Loss S21 (Each Line)
1: -16.912 dB 900 MHz 2: -10.401 dB 1.8 GHz 3: -8.2212 dB 2.5 GHz 0 dB -6 dB
3 4
Analog Crosstalk (Each Line)
CH1 S21 LOG 20 dB / REF 0 dB
4: -3.21 dB 259 MHZ
-12 dB -18 dB -24 dB -30 dB -36 dB 1 MHz START . 030 MHz 10 MHz 100 MHz
1
2
3 1 GHz GHz . STOP 3000 000000 MHz START . 030 MHz . STOP 3000 000000 MHz
ESD Clamping (+8kV per IEC 61000-4-2)
ESD Clamping (-8kV per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
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TCLAMP3302N
PROTECTION PRODUCTS Applications Information
Device Connection Options for Protection of Two High-Speed Data Lines These devices are designed to protect two high-speed data lines (one differential pair) from transient overvoltages which result from lightning and ESD. They can be configured to protect in differential (Line-to-Line) and common (Line-to-Ground) mode. Data line inputs/ outputs are connected at pins 1, 2 and 3, and 8, 9 and 10 as shown. For proper operation, pins 1 - 3 must be connected together and pins 8 - 10 must be connected together. Pins 4, 5, 6, and 7 may be left unconnected. For differential operation, the center tab is also left not connected. For common mode operation, the center tab is connected to ground. The ground connection should be made directly to a ground plane on the board for best results. The use of multiple vias is recommended for reduced ground loop inductance. Short-Haul/Intrabuilding Immunity Requirements for Ethernet-based Systems The accelerating demand for bandwidth-hungry services such as Voice over IP, Metropolitan Area Networks (MAN), Ethernet over telecommunications backplanes, and broadband to the home are driving the deployment of high-reliability carrier and enterprise class Ethernet-based systems. These systems require the robust protection of external ports from transient voltage events such as lightning, electrostatic discharge, and cable discharge events. Each new generation of Ethernet deployment yields higherdensity boards that demand protection solutions that occupy less board space. The Telcordia Technologies (Bellcore) GR-1089-CORE specification defines a set of requirements for lightning and AC power cross immunity for intrabuilding equipment. The lightning tests are applied as metallic (lineto-line) or longitudinal (line-to-ground) waveforms. The waveforms are defined with a rise time of 2s and a decay time of 10s with a short circuit current of 100A. One surge of positive and one of negative polarity are applied. To pass the test, the equipment must continue to operate after the test. If a 2/10s generator is unavailable, then a 8/20s waveform may be applied with additional series resistance (6 metallic, 12 longitudinal). Circuit Diagram
LINE 1 (1, 2, 3)
Center Tab
LINE 2 (8, 9, 10)
Configuration (Top View) Pin Conf iguration (Top Side Vie w)
1 2 3 4 5 GND
10 9 8 7 6
Pin 1, 2, 3 8, 9, 10 4, 5, 6, 7 Center Tab
Identification Line 1 in/out Line 2 in/out N o Connect Ground
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TCLAMP3302N
PROTECTION PRODUCTS Typical Applications
Rs
TCLAMP3302N
Rs Rs
MagJack
TCLAMP3302N
Rs Rs
TCLAMP3302N
Rs Rs
TCLAMP3302N
Rs
Note: Rs = 2 Ohm, 1% tolerance
Schematic Diagram for Telcordia GR-1089 Intra-Building Protection Gigabit Ethernet with Magjack
Rs
TCLAMP3302N TCLAMP3302N
1
2 1 2
Rs
TCLAMP3302N TCLAMP3302N
1
2 1 2
Rs
TCLAMP3302N TCLAMP3302N
1
2 1 2
Rs
TCLAMP3302N TCLAMP3302N
1
2 1 2
Rs
Note: Rs = 2 Ohm, 1% tolerance
Layout Diagram for Telcordia GR- 1089 Intra-Building Protection Gigabit Ethernet
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TCLAMP3302N
PROTECTION PRODUCTS Applications Information - Spice Model
TCLAMP3302N Spice Model & Parameters
D3 D1
D2
D3
D2
TCLAMP3302N Spice Model
TCLAMP3302N Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 1.4E-11 3.3 8 0.04 1E-3 400e-12 2.541E-9 0.256 1.1 1.11 D2 (LCR D) 1.001E-20 150 0.59 0.075 1E-3 11.0E-12 2.541E-9 0.01 1.1 1.11 D3 (LCR D) 1.001E-20 150 0.59 0.05 1E-3 11.0E-12 2.541E-9 0.01 1.1 1.11
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TCLAMP3302N
PROTECTION PRODUCTS Outline Drawing - SLP2626P10
A D B
DIM
PIN 1 INDICATOR (LASER MARK)
E
A aaa C A2 D1 C 12L E/2 C L E1 LxN e N bxN D/2 bbb A1 C
SEATING PLANE
A A1 A2 b D D1 E E1 e L N aaa bbb
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .024 .026 0.50 0.60 0.65 .000 .001 .002 0.00 0.03 0.05 (.007) (0.17) .007 .010 .012 0.20 0.25 0.30 .098 .102 .106 2.50 2.60 2.70 .079 .085 .089 2.00 2.15 2.25 .098 .102 .106 2.50 2.60 2.70 .044 .050 .054 1.11 1.26 1.36 .020 BSC 0.50 BSC .011 .014 .016 0.30 0.35 0.40 10 10 .003 0.08 .004 0.10
CAB
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP2626P10
P
X
Z
G
F
(C)
DIM B C F G P X Y Z
DIMENSIONS INCHES MILLIMETERS .081 2.05 .100 2.50 .050 1.26 .073 1.85 .020 0.50 .012 0.30 .025 0.65 .124 3.15
Y
B
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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TCLAMP3302N
PROTECTION PRODUCTS Marking Ordering Information
Part Number TCLAMP3302N.TCT Qty per Reel 3,000 Reel Size 7 Inch
3302N YYWW
YY = year WW = Week
Note: Lead finish is lead-free NiPdAu TransClamp and TClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0 2.77 +/-0.10 mm B0 2.77 +/-0.10 mm K0 0.80 +/-0.10 mm
Tape Width
B, (Max)
D
D1
E
F
K (MAX)
P
P0
P2
T(MAX)
W 8.0 mm + 0.3 mm - 0.1 mm
8 mm
4.2 mm (.165)
1.5 + 0.1 mm - 0.0 mm
1.0 mm 0.05
1.750.10 mm
3.50.05 mm
2.4 mm
4.00.1 mm
4.00.1 mm
2.00.05 mm
0.4 mm
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
2008 Semtech Corp. 9 www.semtech.com

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